Customized solutions from manual single-process benches to fully automated wafer handling systems
Exentec can customize substrate carriers and end effectors to accommodate unique processing requirements. We support a wide range of substrates and materials:
- Wafers (100mm – 300mm)
- III-V semiconductor materials
- Photomasks
- Glass and quartz fixtures
- Custom manifolds and specialty carriers
Our engineers can also design custom end effectors and substrate carriers to meet your specific process and handling needs.
- Cleaning, resist strips, etching, development, metal lift-off, IPA recovery and drying
- Usable for acid, base and solvent applications
- Single or multi-cassette bath sizes
Surface preparation systems are scalable and ready for integration into cleanrooms, R&D labs, and high-volume fabs.
Wet Process Options
Wet Process Options
Our team has experience with a wide range of application needs including work in FEOL, BEOL, Advanced Packaging, MEMS Pattern Plating, Magnetic Deposition, Electro-Etch, and E-less Deposition. We also have standard wet process bath layouts available for many applications such as:
- Wet Etching – Silicon (KOH) etch, Nitride etch, buffered oxide etch, photoresist strip, and gold/platinum etch.
- Metal Lift-Off – NMP and DMSO configurations
- Wafer Clean – Support for HF, Piranha, SC1, SC2 baths
Wet Process Equipment Configuration
Wet Process Equipment Configuration
Our process tools can be configured with a complete range of support systems to enhance automation, safety, and chemical management:
- Chemical Handling Systems
- Chemical carts for dispense, removal, and storage
- Onboard carboys for waste collection
- Lift stations for waste neutralization
Process Optimization Hardware
Process Optimization Hardware
- Temperature-controlled circulators (WHRV) - Heating: up to 5115 BTU/hr; Cooling: up to 2550 BTU/hr
- Recirculating baths for consistent temperature and flow
- Quartz tanks for chemical resistance
- Quick Dump Rinsers (QDR) - Immersion, cascade, and spray modes
Wet Process Options
Wet Process Options
Our team has experience with a wide range of application needs including work in FEOL, BEOL, Advanced Packaging, MEMS Pattern Plating, Magnetic Deposition, Electro-Etch, and E-less Deposition. We also have standard wet process bath layouts available for many applications such as:
- Wet Etching – Silicon (KOH) etch, Nitride etch, buffered oxide etch, photoresist strip, and gold/platinum etch.
- Metal Lift-Off – NMP and DMSO configurations
- Wafer Clean – Support for HF, Piranha, SC1, SC2 baths