Semiconductor
Semiconductor facility ramp-up and tool installation

Semiconductor
Semiconductor facility ramp-up and tool installation
Exentec supported the installation and commissioning of 193 advanced test tools within a major semiconductor facility in Malaysia.
Project overview
The project supported the installation and readiness of 193 advanced test tools within a critical semiconductor manufacturing facility. Despite substantial design changes during delivery, Exentec successfully reduced the requirement for new utility laterals from 19 to just three through collaborative engineering and layout optimisation. The project combined design, procurement, construction and testing activities within an accelerated programme timeframe.
The challenge
A leading semiconductor manufacturer required the installation and commissioning of advanced test tools within a new advanced packaging facility in Malaysia. The project involved preparing 54 tools for testing and commissioning within an aggressive 14-week programme, followed by the delivery of a further 139 tools as part of the facility ramp-up. The compressed schedule was further complicated by significant utility infrastructure modifications and late-stage changes to the tool installation sequence.
Exentec's solution
Exentec deployed dedicated design teams to manage both tool installation and progressive build activities, redesigning utility infrastructure to suit the facility layout while minimising disruption to the project schedule. Working closely with the client, Exentec implemented an accelerated procurement strategy, leveraged strategic inventory, mobilised multiple specialist contractors and adopted a two-shift working model to maintain progress. Engineering collaboration also enabled significant reductions in additional infrastructure requirements following changes to the tool set.
The results
By combining engineering expertise, agile project execution and close client collaboration, Exentec maintained progress towards critical production milestones despite programme changes and supply-chain constraints. The approach enabled continued facility ramp-up, accelerated tool readiness and maintained schedule certainty for a strategically important semiconductor manufacturing investment.
Experience that delivers
- 193 semiconductor tools supported across initial and full-ramp installation phases
- 19 planned utility laterals reduced to just 3 through engineering optimization
- 300-400 personnel mobilised across a two-shift delivery programme
- Zero lost-time incidents achieved during project execution